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May 1998

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TechNet <[log in to unmask]>
Subject:
source of adhesive coper foil
From:
Paul Wilson <[log in to unmask]>
Date:
Fri, 29 May 1998 09:37:14 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Paul Wilson <[log in to unmask]>
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Technet:

Does anyone have a list of manufacturer's of adhesive copper tape capable of withstanding  plating conditions?

Thank you,
Paul Wilson
Plant Chemist
Circuit Center, Inc.
937-435-2131

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