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Date: | Sun, 19 Jun 2011 22:28:55 +0300 |
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1. Change layout
2. Via cap filling
3. Plugging from one side only (component side).
Reuven
On Fri, Jun 17, 2011 at 7:59 PM, Richard D. Krug <[log in to unmask]> wrote:
> We've got a customer's PWB that has vias with the barrel either coated with
> solder mask or epoxy filled, then covered with solder mask. The plugging
> tends to leave a small protrusion above the copper surface. Some of these
> locations happen to be centered at MELF locations. During reflow, MELF's
> shift off the high point.
>
> Prevention / mitigation ideas anyone?
>
>
> Dick Krug, SSBB, CSMTPE
> SMT Process Engineer
> Sparton Corporation
> 30167 Power Line Road
> Brooksville, FL 34602-8299
> p (352) 540-4012 (Internal Ext. 2012)
> [log in to unmask]
>
> ______________________________________________________________________
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--
Best Regards,
*Reuven Rokah*
Mobile: 972-52-60-120-18
Tele-fax: 97239360688
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com
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