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November 1998

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TechNet <[log in to unmask]>
Subject:
Re: Logic Device, drop test failure
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Date:
Wed, 11 Nov 1998 11:25:00 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Jim Marsico 516-595-5879 <[log in to unmask]>
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We use a thermally conductive paste or pressure sensitive tape under quad flat
packs to reduce deflection due to vibration.  This works well except that
assembly and rework is more difficult.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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