TECHNET Archives

January 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
Subject:
Re: Re-heats
From:
[log in to unmask]
Date:
Wed, 20 Jan 1999 09:02:20 EST
Content-transfer-encoding:
7bit
Content-type:
text/plain; charset=US-ASCII
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (27 lines) 
The test method you are referring to is 2.4.36 Rework Simulation,
Plated-Through Holes for Leaded Components

This is available on the IPC website for free downloading.  The most
recent rev is B.

In the scope of the method it explains that the 5 heating steps are
designed to simulate initial soldering after a preconditioning bake and
two (2) subsequent replacements.

Both MIL-PRF-55110 and IPC-6012 use this method.

Susan Mansilla
Robisan Lab

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2