TECHNET Archives

January 2008

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Wed, 23 Jan 2008 09:58:17 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Sue Powers-hartman <[log in to unmask]>
Subject:
Solder fines
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="windows-1252"
From:
Sue Powers-hartman <[log in to unmask]>
Parts/Attachments:
text/plain (15 lines) 
We are having a problem with tiny solder fines that are clinging to fine pitch 
SOIC leads, not on the solder mask, that are not being washed off in the 
cleaning process. Are solder fines considered the same as a solder ball, which 
means they all have to be removed, or is it acceptable to leave them alone.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2