Matthias,

No, I am refering to adhesive bonding of a large part (a metallic spring
finger in fact).

-Steve


Steven K. Lustig
Process Engineer
EMS Technologies, Inc.
Norcross, GA
(770) 263-9200 x4714
[log in to unmask]


-----Original Message-----
From: Matthias Mansfeld [mailto:[log in to unmask]]
Sent: Wednesday, October 06, 1999 10:29 AM
To: Lustig, Steven K..; [log in to unmask]
Subject: Wire(?) Bonding, was: Re: [TN] Temporary Solder Mask


On  6 Oct 99 at 7:53, Lustig, Steven K.. wrote:

[......]
>..  as well as a strip where we
> bond a part subsequently.
[...]
.. just curious - do you mean chip bonding (bare dies), any glue
operations with standard components, or wire bonding?

I'm looking for a reliable process to protect wire bonding areas
(mostly immeesion NiAu for Al wire bonding) with something like a
temporary soldermask against any dirt from SMD process, instead of
expensive cleaning processes like plasma...

Thanks, regards
Matthias Mansfeld


-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de

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