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October 2001

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TechNet <[log in to unmask]>
Subject:
Reject Marking
From:
Ken Hafften <[log in to unmask]>
Date:
Thu, 18 Oct 2001 08:30:00 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>
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Presently we identify rejected parts on multiple up panels after lamination
by using an "X" made with a metal stamp.  This stamped "X" creates other
problems during the subsequent circuit board manufacturing process steps
such as an uneven surface for imaging.  Does anyone have another method for
marking rejects at lamination.

Thanks in advance for any assistance.

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