TECHNET Archives

March 2003

TechNet@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Sn97Cu3 solder
From:
Phillip Hinton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 21 Mar 2003 11:33:04 EST
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (1122 bytes) , text/html (1294 bytes) 
All

I know all of you have headed APEX, have a drink on me.  But I have a
question: Is there any information on an alloy that is Sn97and Cu3?.  It is
proposed that the internal intermetallic formation makes it a strong solder
joint for higher temperature applications.  And it has also been proposed
that the excess copper will lead to brittleness as the 4% gold does to solder


Phil Hinton

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2