At 09:18 PM 12/12/01 -0600, you wrote:
>Date: Wed, 12 Dec 2001 21:18:22 -0600
>Reply-To: TechNet <[log in to unmask]>
>Sender: TechNet <[log in to unmask]>
>From: Automatic digest processor <[log in to unmask]>
>Subject: TechNet Digest - 12 Dec 2001 - Special issue (#2001-774)
>To: Recipients of TechNet digests <[log in to unmask]>
>
>There are 14 messages totalling 945 lines in this issue.
>
>Topics in this special issue:
>
> 1. Measure of Quality Performance
> 2. Sodium Silicate Contamination (3)
> 3. LLP (3)
> 4. Interesting trend lately...
> 5. IPC Supplier Audit Guidelines (3)
> 6. To form or not to Form (2)
> 7. Solderability of Organic Silver PCB's
>
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>---------------------------------------------------------------------------
>------
>Date: Wed, 12 Dec 2001 10:59:00 -0600
>From: Scott Kauling <[log in to unmask]>
>Subject: Re: Measure of Quality Performance
>
>Cathy,
>
>IPC 7912 is your standard, it explains how to calculate defects per million
>opportunities and how to calculate manufacturing indices for PCA's.
>
>Good Luck,
>SCOTT
>
>-----Original Message-----
>From: Cathy Killen [SMTP:[log in to unmask]]
>Sent: Wednesday, December 12, 2001 10:10 AM
>To: [log in to unmask]
>Subject: [TN] Measure of Quality Performance
>Importance: High
>
>Hi,
>What would technetters recommend as the best measure of quality performance
>in contract assembly with a high level of small to medium batches (10-100)?
>
>
>Cathy Killen
>Training Instructor
>Smtek Europe Ltd.
>The information contained in the E-mail is confidential. It is intended
>only
>for the stated addressee(s) and access to it by any other person is
>unauthorised.
>The views expressed in this E-mail are those of the author, and do not
>represent the views of Smtek Europe, its associates or subsidiaries, unless
>otherwise expressly indicated.
>Please note: It is your responsibility to scan this E-mail for viruses.
>
>------------------------------------------------------------------------
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>ext.5315
>------------------------------------------------------------------------
>---------
>Date: Wed, 12 Dec 2001 10:20:26 -0700
>From: "Faraci, Jennifer L" <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain
>
>Do you have any idea how either of these (Sodium Silicate or Silicon
>Dioxide) will effect the electrical performance of circuit cards?
>
>-----Original Message-----
>From: <Rudy Sedlak> [mailto:[log in to unmask]]
>Sent: Tuesday, December 11, 2001 1:21 PM
>To: [log in to unmask]
>Subject: Re: [TN] Sodium Silicate Contamination
>
>
>Jennifer:
>
>You probably did not discover Sodium Silcate...which, in small particles and
>quantities is rapidly neutralized by the Carbon Dioxide in air to a form of
>Hydrated Silicon Dioxide.....which is actually known as "Silicic Acid", but
>is about as acidic as Carbon Dioxide in air..
>
>The truth is that the stuff in small quantities is essentially harmless to
>human beings. I would ignore it.
>
>If you want to clean it up, probably the only reasonable way is to use a
>simple mild detergent solution. If you want to remove every last atom of
>Silicon Dioxide you would have to use some VERY hazardous chemicals.
>
>My advice: Have a nice holiday...if people want to feel like they have "done
>something to cure the problem"...wash the floor.
>
>Rudy Sedlak
>RD Chemical Company
>
>----------------------------------------------------------------------------
>-----
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>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
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>ext.5315
>----------------------------------------------------------------------------
>-----
>Date: Wed, 12 Dec 2001 12:45:13 -0500
>From: "MAZZI,DON (HP-Boise,ex1)" <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset="windows-1252"
>
>C:\Program File:Vi\SPIOrRam Files\Visio
>
> -----Original Message-----
>From: Faraci, Jennifer L [mailto:[log in to unmask]]
>Sent: Wednesday, December 12, 2001 10:20 AM
>To: [log in to unmask]
>Subject: Re: [TN] Sodium Silicate Contamination
>
>Do you have any idea how either of these (Sodium Silicate or Silicon
>Dioxide) will effect the electrical performance of circuit cards?
>
>-----Original Message-----
>From: <Rudy Sedlak> [mailto:[log in to unmask]]
>Sent: Tuesday, December 11, 2001 1:21 PM
>To: [log in to unmask]
>Subject: Re: [TN] Sodium Silicate Contamination
>
>
>Jennifer:
>
>You probably did not discover Sodium Silcate...which, in small particles and
>quantities is rapidly neutralized by the Carbon Dioxide in air to a form of
>Hydrated Silicon Dioxide.....which is actually known as "Silicic Acid", but
>is about as acidic as Carbon Dioxide in air..
>
>The truth is that the stuff in small quantities is essentially harmless to
>human beings. I would ignore it.
>
>If you want to clean it up, probably the only reasonable way is to use a
>simple mild detergent solution. If you want to remove every last atom of
>Silicon Dioxide you would have to use some VERY hazardous chemicals.
>
>My advice: Have a nice holiday...if people want to feel like they have "done
>something to cure the problem"...wash the floor.
>
>Rudy Sedlak
>RD Chemical Company
>
>----------------------------------------------------------------------------
>-----
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>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
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>----------------------------------------------------------------------------
>-----
>
>----------------------------------------------------------------------------
>-----
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>----------------------------------------------------------------------------
>-----
>Date: Wed, 12 Dec 2001 19:02:24 +0100
>From: "Zweigart, Siegmund" <[log in to unmask]>
>Subject: LLP
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Hello
>
>We are trying to do a detailed Qualification of an assembly and repair-
>process for LLP (and similar)- packages.
>Has anybody infomation regarding this subjects.
>Will the amount of LLP increase in the future?
>How can I get information about this topic?
>
>Best regards
>
>Siegmund Zweigart
>----------------------------------------------------------------------------
>--------------------
>Kind regards / Mit freundlichen Grüßen
>
>Dr. Siegmund Zweigart
>New Technology Manager
>
>Solectron GmbH
>Solectronstrasse 2 Fon. ++49 7032 998 194
>D - 71083 Herrenberg Fax ++49 7032 998 49 222
>
>e-mail: [log in to unmask]
>internet: www.solectron.com
>----------------------------------------------------------------------------
>--------------------
>Date: Wed, 12 Dec 2001 13:54:59 EST
>From: "Stephen R. Gregory" <[log in to unmask]>
>Subject: Re: LLP
>MIME-Version: 1.0
>Content-Type: multipart/alternative;
>boundary="part1_d7.10976ab6.29490203_boundary"
>
>Hi Siegmund!
>
>Go to: http://www.national.com/packaging/llp/
>
>and you'll find Application Notes AN-1187 which is all about LLP's.
>Designing them in assemblies, reflow profiles, and rework procedures.
>There's even a RealMedia video there that is showing the steps to use when
>reworking them. They're using a OK Systems (now Metcal) BGA 3000 rework
>system.
>
>According to National Semiconductor, LLP's are perfect for a wide variety
>of applications. Such as:
>
>Cell Phones
>GPS Receivers
>Pagers
>PDA’s
>Personal stereo / CD
>Hard disk drives
>Hand held portable devices
>Toys
>Notebooks
>
>-Steve Gregory-
>
>
>
>
>
>>Hello
>>
>>We are trying to do a detailed Qualification of an assembly and repair-
>>process for LLP (and similar)- packages.
>>Has anybody infomation regarding this subjects.
>>Will the amount of LLP increase in the future?
>>How can I get information about this topic?
>>
>>Best regards
>>
>>Siegmund Zweigart
>
>
>
>
>
>
>
>
>
>
>
>Date: Wed, 12 Dec 2001 13:30:57 -0700
>From: Steve Abrahamson <[log in to unmask]>
>Subject: Re: Interesting trend lately...
>
>Theory 3, which many of these OEM's may hide behind is that if company A
>buys an ACME pick and place machine and beats the heck out of it, never
>performs any preventive maintenance on the machine, then sells it to company
>B. Company B may have problems with the machine and start to assume that
>ACME equipment is awful. Even if the ACME guys come in and say that the
>company A abused the machine and that the performance is not indicative of
>well cared for ACME equipment, it would be hard to change the view of
>management- and thus ACME may lose millions of potential sales in the
>future.
>
>This would often be the OEM argument, and it makes sense, however I believe
>the other theories play as large or larger a part in the equipment buy up.
>
>Steve A
>
> > -----Original Message-----
> > From: Stephen R. Gregory [SMTP:[log in to unmask]]
> > Sent: Tuesday,December 11,2001 8:16 PM
> > To: [log in to unmask]
> > Subject: [TN] Interesting trend lately...
> >
> > Just thought I'd pass on something that I've just learned about. We've
> > been
> > looking at purchasing some used, or more politically correct I suppose,
> > "pre-owned" pick and place equipment.
> >
> > Have found out that there are OEM's of these machines out there, that are
> > buying as many of the used machines that are out in the open market as
> > they
> > can, to prevent them from being sold to the general market (like us guys)
> > that want to buy them...just found that rather interesting...
> >
> > They don't want their used machines being sold and traded, and are trying
> > to
> > make sure that anybody that wants their equipment has to buy "New" from
> > them
> > by taking as many of the used machines off the market as they can...I
> > guess
> > that is one marketing strategy...don't really understand it, but I guess
> > that's why I'm not a sales guy...
> >
> > Have any of you heard about this?
> >
> > -Steve Gregory-
> >
> > --------------------------------------------------------------------------
> > -------
> > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following message: SET
> > Technet NOMAIL
> > Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> > E-mail Archives
> > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> > additional
> > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> > ext.5315
> > --------------------------------------------------------------------------
> > -------
>Date: Wed, 12 Dec 2001 13:10:29 -0800
>From: "Jana L. Carraway" <[log in to unmask]>
>Subject: IPC Supplier Audit Guidelines
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>Content-Transfer-Encoding: 7bit
>
>Greetings All,
>
>I have in the back of my mind, a dusty place indeed, that IPC had a document
>containing Supplier Audit guidelines. I have surfed the IPC site and do not
>find such a document in the Technical Publications pdf. Does IPC have
>something like this, or ... I'm losing it!
>Thanks for the help,
>Jana Carraway
>Micro Systems Engineering, Inc.
>Date: Wed, 12 Dec 2001 16:35:56 EST
>From: "<Rudy Sedlak>" <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset="US-ASCII"
>Content-Transfer-Encoding: 7bit
>
>Sodium Silicate is ionic, and can give you problems passing SIR type tests....
>
>Silicon Dioxide is what is found in the little "water absorbing" pillows
>sometimes used in packages to keep things dry...and likely will give you no
>problems whatever.
>
>If you pass the usual ion contamination tests, you can probably ignore the
>whole thing.
>
>Rudy Sedlak
>RD Chemical Company
>Date: Wed, 12 Dec 2001 17:09:14 EST
>From: "Stephen R. Gregory" <[log in to unmask]>
>Subject: Re: IPC Supplier Audit Guidelines
>MIME-Version: 1.0
>Content-Type: multipart/alternative;
>boundary="part1_d0.1f702b33.29492f8a_boundary"
>
>Hi Jana,
>
>Go to www.ipc.org, then click on Online Resources and Databases, then
>scroll all the way down to IPC Documents Available for Download and click
>on that.
>
>You will find:
>
>IPC-1710 OEM
>Standard for Printed Board Manufacturers' Qualification Profile
>
>Developed by the OEM council of the IPC, the MQP sets the standard for
>assessing PWB manufacturers capabilities and allows PWB manufacturers to
>more easily satisfy customer requirements.
>
>IPC-1720
>Assembly Qualification Profile Developed by the OEM council of the IPC,
>IPC-1720 categorized an electronic assembly manufacturer's capabilities
>and supplies the OEM customer with detailed, substantive information.
>
>IPC-1730A
>Laminator Qualifier Profile
>Are you a laminate manufacturer looking to provide your customers with a
>consistent, detailed report on your facility(s)? IPC-1730A is the one tool
>laminate manufacturers can use to provide current and potential customers
>with a profile of their facilities. By completing this questionnaire,
>laminators can provide information on materials supplied, approvals and
>certifications, testing available, equipment capabilities and more!
>
>IPC-1731
>Strategic Raw Materials Supplier Qualification Profile (SRMSQP)
>Suppliers of raw materials to laminate manufacture now have an industry
>approved questionaire to supply current and potential customers with a
>self assessment of their facility(s). IPC-1731 gives suppliers of raw
>materials the opportunity to create a profile of their manufacturing
>facility(s) that will be consistent with those developed by similar
>suppliers. Using the MS Word template enables easy creation and
>maintenance of the file(s) and provide their customers with an electronic
>file for their records.
>
>-Steve Gregory-
>
>
>
>
>
>
>
>>Greetings All,
>>
>>I have in the back of my mind, a dusty place indeed, that IPC had a document
>>containing Supplier Audit guidelines. I have surfed the IPC site and do not
>>find such a document in the Technical Publications pdf. Does IPC have
>>something like this, or ... I'm losing it!
>>Thanks for the help,
>>Jana Carraway
>>Micro Systems Engineering, Inc.
>
>
>
>
>
>
>
>
>
>
>
>Date: Wed, 12 Dec 2001 16:25:01 -0700
>From: Lucas Paul-R32425 <[log in to unmask]>
>Subject: Re: To form or not to Form
>MIME-Version: 1.0
>Content-Type: text/plain
>
>Andre,
>
>Is there clearance around the capacitor? If there is, why not lay the part
>flat on its side with the legs parallel to the board and then form the
>leads to fit the holes? It will take several bends to align to the hole
>and another bend to put the leads down into the hole but,the part will be
>flat against the board and there will be no stress on the leads at the
>body part.
>
>Paul
>
>-----Original Message-----
>From: Andre Leclair [mailto:[log in to unmask]]
>Sent: Wednesday, December 12, 2001 6:26 AM
>To: [log in to unmask]
>Subject: [TN] To form or not to Form
>
>
>Hi all
>I hope this gets some good advice.
>
>I have a customer who is requiring the placement of an electrolitic cap
>that has a lead spacing of 0.140" and the PCB has 0.100". They do not want
>the leads formed, they want the part flat to the board. In doing this, am
>I opening myself up to stress induced failures of the component.
>
>---------------------------------------------------------------------------
>------
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>To unsubscribe, send a message to [log in to unmask] with following text in
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>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>---------------------------------------------------------------------------
>------
>Date: Wed, 12 Dec 2001 16:47:36 -0800
>From: "Jana L. Carraway" <[log in to unmask]>
>Subject: Re: IPC Supplier Audit Guidelines
>MIME-Version: 1.0
>Content-Type: multipart/alternative;
>boundary="----=_NextPart_000_003B_01C1832C.B3D142C0"
>
>Thank you very much!
>Jana Carraway
>>-----Original Message-----
>>From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen R. Gregory
>>Sent: Wednesday, December 12, 2001 2:09 PM
>>To: [log in to unmask]
>>Subject: Re: [TN] IPC Supplier Audit Guidelines
>>
>>Hi Jana,
>>
>>Go to www.ipc.org, then click on Online Resources and Databases, then
>>scroll all the way down to IPC Documents Available for Download and click
>>on that.
>>
>Date: Thu, 13 Dec 2001 09:51:36 +0800
>From: "<Peter George Duncan>" <[log in to unmask]>
>Subject: Re: To form or not to Form
>MIME-Version: 1.0
>Content-Type: text/plain; charset=us-ascii
>
>I second Paul's suggestion, and back up all the other comments that have
>been made about the dangers of trying to "normally" mount an electrolytic
>in this situation. Is your customer just arrogantly stubborn, or does he
>have a very good reason for needing the componenet mounted hard down? It
>really isn't possible to do without component damage in the short term,
>unless you are allowed to put a stand-off/isolator washer between component
>and PCB that accommodates the stress relief forming of the leads (such
>isolators are available). The isolator would offer mechanical support to
>the electrolytic while also providing relief to the leads (unless there is
>a height constraint).
>
>If you are still forced to follow customer instruction to hard-mount, I
>would issue a written disclaimer that you will not be held responsible for
>the failure of this component.
>
>Good luck. Hope there isn't too big a rock near the hard place.
>
>Peter Duncan
>
>
>
>
> Lucas
> Paul-R32425 To: [log in to unmask]
> <Paul.Lucas@MOT cc: (bcc: DUNCAN
> Peter/Asst Prin Engr/ST
> OROLA.COM> Aero/ST Group)
> Sent by: Subject: Re: [TN] To form
> or not to Form
> TechNet
> <[log in to unmask]
> G>
>
>
> 12/13/01 07:25
> AM
> Please respond
> to "TechNet
> E-Mail Forum."
>
>
>
>
>
>
>Andre,
>
>Is there clearance around the capacitor? If there is, why not lay the part
>flat on its side with the legs parallel to the board and then form the
>leads to fit the holes? It will take several bends to align to the hole and
>another bend to put the leads down into the hole but,the part will be flat
>against the board and there will be no stress on the leads at the body
>part.
>
>Paul
>
>-----Original Message-----
>From: Andre Leclair [mailto:[log in to unmask]]
>Sent: Wednesday, December 12, 2001 6:26 AM
>To: [log in to unmask]
>Subject: [TN] To form or not to Form
>
>
>Hi all
>I hope this gets some good advice.
>
>I have a customer who is requiring the placement of an electrolitic cap
>that has a lead spacing of 0.140" and the PCB has 0.100". They do not want
>the leads formed, they want the part flat to the board. In doing this, am
>I opening myself up to stress induced failures of the component.
>
>---------------------------------------------------------------------------
>------
>
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
>Technet NOMAIL
>Search previous postings at: www.ipc.org > On-Line Resources & Databases >
>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
>additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>---------------------------------------------------------------------------
>------
>
>
>---------------------------------------------------------------------------
>------
>
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
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>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
>additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>---------------------------------------------------------------------------
>------
>
>
>
>
>
>[This e-mail is confidential and may also be privileged. If you are not the
>intended recipient, please delete it and notify us immediately; you should
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>person. Thank you.]
>Date: Tue, 11 Dec 2001 11:20:14 +0800
>From: Jiang Ping <[log in to unmask]>
>Subject: Re: LLP
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>LPP from Elantec and MLF from Amkor are similar packages. They have
>documents about design and manufacturing issues and should have put them
>on their web sites. I can also send the documents to you directly if you
>can't find them. We have assemblied a few hundreds of them and found no
>defects yet.
>
>Jiang Ping
>
>----- Original Message -----
>From: Zweigart, Siegmund <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, December 13, 2001 2:02 AM
>Subject: [TN] LLP
>
>
>Hello
>
>We are trying to do a detailed Qualification of an assembly and repair-
>process for LLP (and similar)- packages.
>Has anybody infomation regarding this subjects.
>Will the amount of LLP increase in the future?
>How can I get information about this topic?
>
>Best regards
>
>Siegmund Zweigart
>----------------------------------------------------------------------------
>--------------------
>Kind regards / Mit freundlichen Grüßen
>
>Dr. Siegmund Zweigart
>New Technology Manager
>
>Solectron GmbH
>Solectronstrasse 2 Fon. ++49 7032 998 194
>D - 71083 Herrenberg Fax ++49 7032 998 49 222
>
>e-mail: [log in to unmask]
>internet: www.solectron.com
>----------------------------------------------------------------------------
>--------------------
>
>---------------------------------------------------------------------------
>------
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
>Technet NOMAIL
>Search previous postings at: www.ipc.org > On-Line Resources & Databases >
>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>---------------------------------------------------------------------------
>------Date: Thu, 13 Dec 2001 16:21:37 +1300
>From: Michael Bell <[log in to unmask]>
>Subject: Solderability of Organic Silver PCB's
>MIME-Version: 1.0
>Content-Type: multipart/alternative;
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>Hi all,
>
>I am currently having a few problems with soldering an Organic Silver
>finished PCB. The PCB is a Rodgers material, but I have no information on
>the exact type. I am using Multicore X33-12i no-clean flux, but this
>appears to have no effect on the pads. All of the joints are partial, and
>have very poor wetting, if any!! Has anyone had similar problems to
>this??? Any suggestions on how to fix this?? Unfortunately I can't use a
>clean flux as I don't have the facility to clean PCB's.
>
>Cheers
>
>Mike
Hi,
I will be back on 12/17/01.
Regards,
Jong
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