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January 2002

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Tue, 8 Jan 2002 13:07:02 EST
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Resin recession is where the resin moves away from the copper plating when it
gets hot from HASL or assembly processing.

Hole wall pullaway is where the copper moves - usually due to lack of
adhesion to the hole wall - again when the hole is exposed to heat.

Neither one of these conditions is considered a "defect".  Just an indication
that the board is not at optimum conditions.

Susan Mansilla
Technical Director
Robisan Lab



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