TECHNET Archives

January 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Transfer-Encoding:
QUOTED-PRINTABLE
Sender:
TechNet <[log in to unmask]>
Subject:
pull-test to QFP and BGA
From:
José Alejandro Becerra Chiu <[log in to unmask]>
Date:
Fri, 22 Jan 1999 14:04:18 -0600
Content-Type:
TEXT/PLAIN; charset=US-ASCII
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, José Alejandro Becerra Chiu <[log in to unmask]>
Parts/Attachments:
TEXT/PLAIN (28 lines) 
Hi Technetters:

Does anyone know about equipment to perform pull-test?
We are interested in perform pull test to solder joints of
QFP´s and BGA, in order to obtain their strength.

Thank you
           
Alejandro Becerra
Research assistant
Laboratory for Electronic Manufacturing
ITESM
Monterrey, N.L., Mexico
(8)3-58-20-00 Ext. 5122
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2