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<miso!rrnet.com!phoeintl> |
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Fri, 15 Dec 1995 11:34:57 -0600 (CST) |
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| From [log in to unmask] Sat Apr 27 15: |
30:16 1996 |
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Phoenix International <phoeintl@com> |
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What have companies done to address the cracking problem of multi-layer
cermaic chip capacitors? We see cracking problems with 0.1 and 0.01
microfarad X7R ceramic caps. The defect is more a mechanical stress crack
and not a thermal stress crack.
We understand some companies prohibit this type of component from being
included in product design. Does anyone have ideas how a company can
successfully use these components? Are there alternative components that
can be used to replace the X7R capacitor?
Suggestions, comments and horror stories welcomed.
Thanks. Rick Vernon, Phoeinx International
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