In a message dated 10/29/02 10:10:21 AM Central Standard Time,
[log in to unmask] writes:

Ryan,

For the answer to your first question you will need to know the process
parameters and the operating temperature of the assembly.  The rate is highly
dependent on temperature.  As for nickel, the rates are factors lower but
with gold it is almost instant.

Larry Tawyea
713-829-1166


>
> Hi Technetters,
>
> I can't find my references for the dissolution rate of Tin into eutectic Tin
> Lead solder.  Anyone know?  And while we're at it, what is it for Nickel and
> Gold?
>
> Thanks,
> Ryan Grant
> Supplier Quality Engineer
> (208) 363-3683
> [log in to unmask]
>
>



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