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Date: | Mon, 16 Jul 2007 14:37:15 -0700 |
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Hello ,
Does any one have this article so I can have a copy please?
I need to have it urgent.
Thanks,
Al
Hall, P. M., "Strain measurements during thermal chamber cycling on leadless ceramic chip carriers soldered to printed boards", Proceedings, 34th Electronic Components Conference, New Orleans, LA, May 14-16, 1984, pp. 107-116.
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