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Subject:	Re: Temperature cycling specification
From:	Paul Klasek <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 29 May 2001 08:08:11 +1000
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

IPC-SM-785, Guidelines for Accelerated Reliability Tests, Werner E. (SMT,
that is)
served me well Luca, just instead of silver polymer bridging (fails more
than solder)
use very fine copper links (caps, (dipped in paste prior reflow), for event
detector loops.
Best use Yo own production board, chained -up, not keen on test vehicles.

paul

-----Original Message-----
From: Luca Amato [mailto:[log in to unmask]]
Sent: Tuesday, May 29, 2001 12:54 AM
To: [log in to unmask]
Subject: [TN] Temperature cycling specification


Can anybody provide me with a reference to a standard specification for
solder joint reliability test with particular reference to fatigue tests
(temperature cycling table etc.)?

Luca

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