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There is actually a lot of data regarding conductive adhesives on nearly
every substrate, many by independent organizations; IVF (Swedish Research
Institute), DELTA (Danish Research Group), MCC. Adhesives can be designed
for good junction stability on Sn/Pb and several companies are in
production with same. Our criterion is less than 20% change in junction
resistance after 1000 hr. 85/85 and a properly designed product can
actually increase in conductivity after T&H. The real weakness (based on
customer response) is lower mechanical strength and poor shock (NCMS drop
test) resistance compared to Sn/Pb, especially with J-leads. Adhesives
work in many, but not all applications. For more information, see article
Polymer Electronics at Web site http:/www.alphametals.com and/or read the
new book, "Polymer Thick Film", Van Nostrand Rheinhold, NY, which covers
adhesive assembly.
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