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April 2007

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Subject:
Re: Immersion Tin Wetting
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Tue, 3 Apr 2007 03:47:00 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (44 lines) 
Rich:
  My suspicion is that questionable wetting of Tin is probably due to oxide formation, and reflow might assist, but only maybe.   You would probably get much better results treating the board to remove oxide.   And whereas I know how I would do this, I am not aware of products currently commercially available for this purpose.

  Rudy Sedlak
  RD Chemical Company

Richard Olsen <[log in to unmask]> wrote:
  Hello,

Immersion tin on a bare board.
If wet ability under a BGA is in question should you reflow the tin in oil
prior to assembly?
Would this help or no.

Thank you

Rich Olsen

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