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Subject:	Re: LF Reflow on a Cap
From:	"Kane, Amol (349)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:	Tue, 3 Apr 2007 07:19:47 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

So, in my case it will be minimum 237C for 5 seconds or more. I am using ENIG for the surface finish, so looks like 240C (which is the max I can go on the cap) is the Minimum temp I need for reflow. The cap spec does state that it can go between 240 and 245 C for less than 10 seconds. Hmmm......definitely challenging

Amol

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, April 02, 2007 4:09 PM
To: Kane, Amol (349); [log in to unmask]
Subject: Re: [TN] LF Reflow on a Cap

Hi Amol,
Unfortunately, TAL is not a very useful concept, because it does not tell you how long you were above the needed minimum reflow soldering temperature, which definetely is NOT the Liquidus temperature, and certainly not 183C. You need to be Liquidus (for the solder you are using)+20C for 5 seconds or longer when soldewring to Cu, higher than that if soldering to Ni.

Werner

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