Hi Technetters,

 

I got some questions regarding punching, versus routing, PCBs,

 

1-     Would the edge of a punched high Tg board be rougher than a punched 140 Tg board? 

2-     In addition to using a die that has the proper clearance, between the punch and die, and sharpening the die after the proper number of hits, Are there any other tooling recommendations to improve the quality of the board punched edge?

3-     If the board manufacturer changes routing to punching for a board that has lots of slots and cut-outs, and assuming the manufacturer is using a properly designed die and is doing a proper washing after punching, are there any problems that may occur during the boards assembly (ex. problems with screening the solder paste or dust/fibers from the bare board causing electrical test problems)?

 

Thanks and Regards,

 

Sherif Refaat,

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------