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February 2000

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Subject:
ASSY: PTH -> SMT
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Date:
Mon, 21 Feb 2000 16:33:06 EST
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Lately I have been seeing failure analysis that indicates the failures
were caused by trying to take a through hole component and bending
the leads up and around or under the component body to make it
a surface mount component.  In one case a crystal seal was broken
and another the bends were just too "springy".

Is there a set of suggestions as to how and when and IF this can be
done to a through hole component?

Susan Mansilla
Technical Director
Robisan Lab

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