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June 2013

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>
Date:
Wed, 5 Jun 2013 06:31:37 +0200
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Subject:
Dropbox
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<[log in to unmask]>
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From:
Inge Hernefjord <[log in to unmask]>
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A rather interesting paper from HP (Bulwith): " Intermetallic growth impact
on BGA Leadfree solder joints"
Dropbox/Soldering.....
Dropbox/BGA..

Inge


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