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July 2002

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Subject:
Re: Guidelines for tenting via's
From:
Gary Ferrari <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Jul 2002 09:54:07 EDT
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Ray,

You can find information about tenting vias in IPC-2221 Generic Standard on
Printed Board Design, section 4.5.1 Solder Resist Coatings. It does indicate
that the maximum size for tenting is 1.0 mm for Class 1 and 2 and 0.65 mm for
Class 3 equipment. The tenting acceptability for larger sizes should be
discussed between user and supplier.

Regards,

Gary

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