TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tnXho-000092C; Fri, 16 Feb 96 15:28 CST
Old-Return-Path:
Date:
Fri, 16 Feb 1996 13:32:46 -0800
Precedence:
list
X-Loop:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/2733
TO:
From [log in to unmask] Mon Feb 19 09:
18:32 1996
Return-Path:
Resent-Message-ID:
<"Iqz-y3.0.I17.6SF9n"@ipc>
Subject:
From:
[log in to unmask] (Leo Reynolds )
Resent-From:
Message-Id:
Parts/Attachments:
text/plain (12 lines)
We are going to be placing some 15 mil pitch quad flat packs on boards 
used in an automotive like environment (actually somewhat worse from a 
vibration standpoint) and wonder if there are any additional processing 
steps or techniques required or suggested while assembling or testing 
these boards to assure field success.

Thanks in advance for your consideration.

Leo



ATOM RSS1 RSS2