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April 2019

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Date:
Tue, 9 Apr 2019 10:23:48 -0300
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TechNet E-Mail Forum <[log in to unmask]>, Graham Collins <[log in to unmask]>
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Subject:
Re: risk of PCBA moisture uptake
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Graham Collins <[log in to unmask]>
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Hi Nigel

If we were running a glued-on MSD part on the bottom side of a board and 
then wave soldering it - I would be concerned with MSDs.  Otherwise no 
as the components are not seeing a high heat.

Similarly, doing hot air rework of a board I'm concerned with MSD parts 
adjacent to the rework site, but not far away from it.

Graham Collins
Senior Process Engineer
Sunsel Systems
(902) 444-7867

On 4/9/2019 10:19 AM, Nigel Burtt wrote:
> Do I assume no-one has concerns about popcorn failures of MSDs during wave and selective?

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