TECHNET Archives

September 2019

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
BGA Solderball Attach Equipment Systems
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Thu, 12 Sep 2019 11:32:09 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (10 lines) 
Hi TechNet - we have a BGA solderball attachment process/equipment we use
for some specialty components and the current system has reached its "end
of life". However, that system/company no longer exists. I am looking for
solderball attachment system recommendations (off line responses are just
fine). Thanks in advance.

Dave Hillman
[log in to unmask]
Collins Aerospace

ATOM RSS1 RSS2