Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 13 Mar 2002 16:57:13 -0500 |
Content-Type: | text/plain |
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Hey, Jeff, IPC-9701
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeff Ferry
> Sent: Wednesday, March 13, 2002 3:05 PM
> To: [log in to unmask]
> Subject: [TN] Test Method/Qual Report
>
>
> Technetters,
>
> Looking for a report titled "Performance Test Methods and Qualification
> Requirements for Surface Mount Solder Attachments". Sounds like an IPC
> document but can't track it down. Anyone know where I can look?
>
> Thanks,
>
> Jeff Ferry
> CEO
> Circuit Technology Center, Inc.
> www.circuittechctr.com
> [log in to unmask]
> 978-374-5000
>
> Sign up for our Free E-mail Newsletter at:
> www.circuittechctr.com/general/free_email.htm
>
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the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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