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July 2001

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Subject:
Question of Solder Mask process
From:
Luong Huy Doan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Jul 2001 18:06:22 +0700
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Dear Technetters,

We are using the Electrostatic U-Coater for the Solder Mask process.
Could anyone give some idea about:
1. The Solder Mask adhered inside the small holes (Hole dia. 0.250 mm)
2. Solder mask do not cover on the Blind via hole ( Hole dia. 0.120 mm)

Thanks in advance

Luong Huy Doan
FCV Inc.

 

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