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December 2001

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Dec 2001 13:54:59 EST
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Hi Siegmund!

Go to: http://www.national.com/packaging/llp/

and you'll find Application Notes AN-1187 which is all about LLP's. Designing 
them in assemblies, reflow profiles, and rework procedures. There's even a 
RealMedia video there that is showing the steps to use when reworking them. 
They're using a OK Systems (now Metcal) BGA 3000 rework system.

According to National Semiconductor, LLP's are perfect for a wide variety of 
applications. Such as:

Cell Phones 
GPS Receivers   
Pagers  
PDA’s   
Personal stereo / CD    
Hard disk drives    
Hand held portable devices  
Toys    
Notebooks   

-Steve Gregory-
    
    



> Hello
> 
> We are trying to do a detailed Qualification of an assembly and repair-
> process for LLP (and similar)- packages.
> Has anybody infomation regarding this subjects.
> Will the amount of LLP increase in the future?
> How can I get information about this topic?
> 
> Best regards
> 
> Siegmund Zweigart
> 













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