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October 2010

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Subject:
Pad to Pad ratio, BGA solder bump
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 20 Oct 2010 11:04:56 -0500
Content-Type:
text/plain
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text/plain (59 lines) 
Fellow TechNetters:

   Searching for guideline/Industry Standards for solder bump pad ratio.   The carrier external copper pad to PWB/PCB external copper pad.   I was initially given info that the ration should be close to 1:1.   Otherwise the formation of the solder bmp would vary in shape.  Also solder mask defined mis-registration would cause solder bump mis-shape.    With this shape difference will an imbalance of the solder cause stresses occur.
Carrier pad:  12 mil,	solder bump dia.	14 mil:	PWB/PCB pad:	7 mil

I don't have a cross section yet.   Soon I hope.

Victor
Alias Mr. " X "


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of KennyB
Sent: Wednesday, October 20, 2010 10:12 AM
To: [log in to unmask]
Subject: Re: [TN] NTC Friday quiz 21

As some of you may remember I retired two months ago and I highly recommend
it for anybody and the sooner the better! BUT I have not retired from
TechNet, I still lurk around the edges and enjoy reading everything. I
haven't contributed much lately but sure to find "both" Friday challenges
fun and interesting.

YES - Keep it up!

KennyB



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