Fellow TechNetters: Searching for guideline/Industry Standards for solder bump pad ratio. The carrier external copper pad to PWB/PCB external copper pad. I was initially given info that the ration should be close to 1:1. Otherwise the formation of the solder bmp would vary in shape. Also solder mask defined mis-registration would cause solder bump mis-shape. With this shape difference will an imbalance of the solder cause stresses occur. Carrier pad: 12 mil, solder bump dia. 14 mil: PWB/PCB pad: 7 mil I don't have a cross section yet. Soon I hope. Victor Alias Mr. " X " -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of KennyB Sent: Wednesday, October 20, 2010 10:12 AM To: [log in to unmask] Subject: Re: [TN] NTC Friday quiz 21 As some of you may remember I retired two months ago and I highly recommend it for anybody and the sooner the better! BUT I have not retired from TechNet, I still lurk around the edges and enjoy reading everything. I haven't contributed much lately but sure to find "both" Friday challenges fun and interesting. YES - Keep it up! KennyB ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------