Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0srApv-0000IDC; Fri, 8 Sep 95 16:19 CDT |
Old-Return-Path: |
<miso!compuserve.com!100537.2615> |
Date: |
08 Sep 95 15:31:21 EDT |
Precedence: |
list |
X-Loop: |
|
Message-ID: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"u-7Sn3.0.3kG.lDBKm"@ipc> |
Subject: |
|
From: |
|
Resent-From: |
|
Resent-Sender: |
|
From [log in to unmask] Sat Apr 27 14: |
45:06 1996 |
Parts/Attachments: |
|
|
If you buy a good quality board you do not need to bake the board. If your
problem is out gassing increase the through hole plating to a minimum of 25um.
Should be between 30-35um. If the problem is delamination the problem is the
bonding or the pre preg.
Bob Willis UK
Tel 01245b 351502
Fax 01245 496123
|
|
|