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February 2001

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TechNet <[log in to unmask]>
Subject:
Thickness of solder
From:
Ken Fong <[log in to unmask]>
Date:
Mon, 12 Feb 2001 11:29:32 +0800
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Dear Technetters,
I've read an article regarding reflow-soldering a stand-up surface mount pins on
a pcb. It says that a thin solder layer between the bottom of the pin and the
solder land is much stronger than a thick joint. Do anyone know the rationale
behind this?

Ken

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