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July 1998

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TechNet <[log in to unmask]>
Subject:
PTH Hole to Lead Ratio
From:
"Signorelli, Paul" <[log in to unmask]>
Date:
Thu, 2 Jul 1998 11:29:23 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Signorelli, Paul" <[log in to unmask]>
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text/plain (18 lines) 
Does anyone know what the optimun Lead to Hole ratio is for Intrusive Reflow
Soldering of 60mil and 100mil thick PCB's.
Paul Signorelli
RW Systems
Fax 719-3822520

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