TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
Re: JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material
From:
Andy RJ McKean <[log in to unmask]>
Date:
Thu, 14 Aug 1997 14:38:03 GMT
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (25 lines) 
John

Is changing to SM over Bare Cu not an option?

 -----Original Message-----
From:   mailnet
Sent:   Thursday, August 14, 1997 2:03 PM
To:     Andy R.J. McKean
Subject:        JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material

From:  JOHN OSULLIVAN <[log in to unmask]>
  REGARDING           Solder mask material

With regard to different solder mask material I'm interested in finding out if
some solder mask materials have differnet thermal masking abilities.
The reason I ask is because of a board I am wave soldering which has heavy
copper layers internally, which forces me to pass the board through the
preheat stage (and over wave) very slowly. The board was manufactured using
all over tin/lead reflow. The tin/lead under the solder mask on large tracks
are reflowing grosely and causing the soldermask to bubble/blister and crack
off, failing the infamous 'tape test'.

Any comments.

ATOM RSS1 RSS2