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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 18 Jul 2000 07:32:56 -0400 |
Content-Type: | text/plain |
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Hello Fellow TechNets,
I'm submitting this for feedback.
For our SMT Assembly lines (stencil; pick-n-place; reflow), I'm
curious as to how companies address ESD issues that can come into play. We
process .032 and .062 multi-layer, mixed technology, panelized boards.
We have a fairly sound 'grass-root' ESD program throughout
Manufacturing, and questions have come up lately regarding the SMT Lines (we
have two of them).
Thanks In Advance,
Ed Noble
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