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December 2000

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Subject:
Land Bond Strength and Peel Strength-Help
From:
賴穗源( sylai ) Q80_5381 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Dec 2000 20:43:54 +0800
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Hi Technetters,
    I had post this question on November, but there is no response about this. I indeed need the help so I post the question again. Please somebody help me. The question is as follows:

   I have a confusion about the land bond strength and peel strength. Is the purpose of land bond strength-unsupport hole the same as the purpose of peel strength which tests the adhesive strength of copper foil on lamination? If it is not, please tell me where is the difference and their purposes.
Thanks!

Best regards,

>
>Albert Lai
> E-MAIL : [log in to unmask]

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