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March 2000

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Subject:
From:
"Erat, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Mar 2000 13:24:26 -0500
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Hello

I have a number of requests on my desk where customers need some areas of
boards with very thick copper (6 to 12 ounces for some heavy duty current)
and the rest of the board with standard fineline features.

Heavy duty plating ?? double imaging ?? etching through a bunch of copper ?
none are attractive options.
Any and all ideas on alternate processes would be appreciated.

Thanks, Wolfgang

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