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February 1997

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From [log in to unmask] Mon Feb 10 15:
29:56 1997
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Fri, 7 Feb 1997 13:02:51 -0700
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DES: ASSY: Chip Scale package availability
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text/plain (34 lines) 
I'm trying to decide when to make the jump to flip-chip in future designs but
I don't think we're ready for C4 with underfill.

Does anyone know of a Chip-scale or Chip-size package other than the
Tessera uBGA that is available at present?  How about next year?
What part types are available/planned?  Now or future...

I saw a lot of ideas at SMI '96 but haven't actually seen any ads for
available parts other than the INTEL Flash memory in Tessera's uBGA
package.

Gary P.
---
                                  Gary D. Peterson
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