Dear TechNetters,

I have a question about the usage of the term "microvia".  Does it refer
specifically to vias (either blind or through) in a build-up layer or does
it refer primarily to the size of the via (say blind or through vias with
diameters less than 150 microns)?

Thanks,
Harvey Phillips

Research Fellow
Microelectronic Materials and Packaging Group
INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING
TEL:    (+65) 872 7545
FAX:    (+65) 872 7528, (+65) 872 0785
e-mail:  [log in to unmask] <mailto:[log in to unmask]>

Block S7, Level 3
National University of Singapore
Singapore 119260

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