Dear TechNetters, I have a question about the usage of the term "microvia". Does it refer specifically to vias (either blind or through) in a build-up layer or does it refer primarily to the size of the via (say blind or through vias with diameters less than 150 microns)? Thanks, Harvey Phillips Research Fellow Microelectronic Materials and Packaging Group INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING TEL: (+65) 872 7545 FAX: (+65) 872 7528, (+65) 872 0785 e-mail: [log in to unmask] <mailto:[log in to unmask]> Block S7, Level 3 National University of Singapore Singapore 119260 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################