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Thu, 10 Dec 1998 12:19:06 +0800 |
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Dear Technetters,
Recently one of our customer request us to further
improve the wave solder ppm (target 200ppm), the major
defect found is the TO220 package component which
contribute over 80% of the total failure, the component
is not preformed and is inserted to the PCB with all the
three leads lie in straight line parallel to the wave
soldering direction, the defect symptom is short solder
between the middle and the last lead. My question is :
1. Will shorten the leads help? Current lead extension
from the bottom of PCB is 2 to 2.5mm .
2. What hole and land size/pattern should be used? Does
any IPC standard mention about this?
3. What is/are the process parameter (wave soldering
process) contribute the problem and what should be
changed to improve this?
Hope someone can help.
Thanks,
WM Cheng
E-mail : [log in to unmask]
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