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We are about to use a TQFP device on a PCB layout, however this
particular part has a very low PCB clearance. (IE Distance between the
underside of the device and the PCB). It is stated as about 2mil in the
data sheet.
Can anyone help me with either experience or standards that can tell me
what the recommended clearance under a device must be to ensure that
adequate cleaning can take place after reflow.
Many thanks,
Ron Wedemeyer
Senior Engineer - Product Engineering
QPSX Communications Pty Ltd
[log in to unmask]
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