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April 2015

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TechNet <[log in to unmask]>
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Date:
Wed, 8 Apr 2015 11:47:53 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Julie Silk <[log in to unmask]>
Subject:
Re: 5 year old BGAs
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Julie Silk <[log in to unmask]>
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I suggest getting the package without balls and reballing as needed.  If there is a solderability problem to the BGA, that's less investment risked than when soldering to the assembly.

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