LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

October 2002

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET October 2002

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show HTML Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: component spacing
From:	Sammie Sutton <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 8 Oct 2002 13:45:21 -0700
Content-Type:	multipart/alternative
Parts/Attachments:	text/plain (3224 bytes) , text/html (4 kB)

We use a minimum .005 and have the vias tented at the fab shop. The tenting is to keep the via from wicking solder from the smt pad. The shop we use doesn't charge any extra for the tenting. We have a standard note for the fab dwg when we use this process.
 
NVISION 
SAMMIE SUTTON 
CAE ENGINEER 
SENIOR PCB DESIGNER 
[log in to unmask] 
 

-----Original Message-----
From: Dave Chapman [mailto:[log in to unmask]]
Sent: Tuesday, October 08, 2002 11:28 AM
To: [log in to unmask]
Subject: Re: [TN] component spacing


What is the minimum spacing between a via and an active SMT pad to avoid shorting. I am looking in IPC 610 but I do not find dimensions only conditions to avoid.
Dave Chapman 
Manufacturing Engineer 
Circuit Service Inc. 

-----Original Message-----

--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- 

--------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- 


---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG