Hard gold is alloyed with Co, Ni or Fe at about 3%. It is harder than
soft gold which is pure gold.
Soft gold may be electroplated, immersion gold of ENIG is also soft gold.
Both soft and hard gold are solderable. Too much gold thickness could
impair the solder joint reliability.
Hard gold is not gold
wire bondable.
Best Regards
George Milad
Chairman IPC Plating Committee
Nat'l Accts Mgr for Technology
Uyemura International corp
516 901 3874
In a message dated 8/15/2012 4:36:04 A.M. Eastern Daylight Time,
[log in to unmask] writes:
Hi everyone,
MIL-G-45204 is the military specification for electrodeposited gold
plating.
I hope it helps.
Sefika Ozkal Piroglu
Aselsan - MGEO Division
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Tuesday, August 14, 2012 9:43 PM
To: [log in to unmask]
Subject: [TN] Hard vs. Soft gold
It is my understanding that both hard and soft gold are electroplated.
The difference is that "soft gold" is essentially pure, whereas "hard gold"
is highly alloyed, often with Cobalt, to harden it.
Rudy Sedlak
RD Chemical Company
--- On Tue, 8/14/12, Guy Ramsey <[log in to unmask]> wrote:
From: Guy Ramsey <[log in to unmask]>
Subject: Re: [TN] PCB finish: ENIG vs. hard gold
To: [log in to unmask]
Date: Tuesday, August 14, 2012, 11:32 AM
I am not sure I can talk to hard or soft gold, and suitability for
soldering.
But, I can say that it is possible to solder to electroplated gold, which
is
different from Immersion Gold finish.
I think some people say hard gold when they mean electroplated gold.
There is a brief discussion of this in Coomb's Handbook.
Guy
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, August 14, 2012 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB finish: ENIG vs. hard gold
Hi everyone,
We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG
finish, due to PCB size and processing capabilities. The application is
Class 3 (mil/aero). The circuit is thin FR4 and subject to SMT reflow w/
Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.
Can anyone offer info on the differences between the two finishes, and/or
their suitability? Is there an IPC spec (or specs) that outline "hard
gold"?
Thanks,
Kevin Glidden
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Best Regards
George Milad
Nat'l Accts Mgr for Technology
Uyemura International corp
516 901 3874
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