If those two pad and balls are nonfuctional then can u ask the component vendor to remove them? This way u eliminate any solder issues. Just an idea. 
Sent from my Blackberry. 

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue May 11 12:07:24 2010
Subject: [TN] Removing BGA Pads for Routing Clearance

Dear 'Netters,

I have an engineer laying out a very small board using a .050 pitch 113
pin BGA with two rows.  He's trying to rout out from the inside row and
in order to avoid using a via, wants to delete the two adjacent pads for
routing space.  If he does, the balls that would have met with those
pads will have about a 2 mil overlay on the routed trace.  We'll be
using an LPI mask and I've told him he could risk bridging from the
solder bump should the mask crack during reflow.  He then told me our
former designer had used that trick before, but wasn't sure on which
product.  We've never had a field failure related to that condition, but
it sure made me cringe.  

My question is how concerned should I be with this arrangement?  


Bob Croslin
The Nielsen Company


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