If those two pad and balls are nonfuctional then can u ask the component vendor to remove them? This way u eliminate any solder issues. Just an idea. Sent from my Blackberry. ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue May 11 12:07:24 2010 Subject: [TN] Removing BGA Pads for Routing Clearance Dear 'Netters, I have an engineer laying out a very small board using a .050 pitch 113 pin BGA with two rows. He's trying to rout out from the inside row and in order to avoid using a via, wants to delete the two adjacent pads for routing space. If he does, the balls that would have met with those pads will have about a 2 mil overlay on the routed trace. We'll be using an LPI mask and I've told him he could risk bridging from the solder bump should the mask crack during reflow. He then told me our former designer had used that trick before, but wasn't sure on which product. We've never had a field failure related to that condition, but it sure made me cringe. My question is how concerned should I be with this arrangement? Bob Croslin The Nielsen Company ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________