Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 20 Dec 2002 11:08:43 -0700 |
Content-Type: | multipart/alternative |
Parts/Attachments: |
|
|
Mark,
I believe the material was FR4 with various Tgs.
Bev Christian at: [log in to unmask] is the chairman of this committee.
You can contact him for more info (it has become very complicated!).
David A. Douthit
Manager
LoCan LLC
Mark Mazzoli wrote:
> Thanks for the info David. I wasn't aware that CAF could form in
> that short amount of time. We've made numerous attempts to locate the
> actual shorts but they don't show themselves. Clearly, if we could
> find one it would make decision making much easier.Thermount is billed
> as an anti CAF material due to the randomness of the fiber. Since it
> does not contain woven strands for channeling CAF, some believe it to
> be resistant to that effect. Our concern is its enthusiasm for water
> absorption. I can see how the absence of fiber "channels" would
> inhibit filament growth but it seems like the accelerated water
> absorption would create a fine growing environment for conductive
> incubation.Are you aware of the materials used in the IPC testing?
>
> -----Original Message-----
> From: David Douthit [mailto:[log in to unmask]]
> Sent: Friday, December 20, 2002 8:58 AM
> To: TechNet E-Mail Forum.; Mark Mazzoli
> Subject: Re: [TN] Thermount for Burn In boards
>
> Mark,
>
> Some round robin testing being done by the IPC committee on
> CAF indicates that there is a "damage" ring around drilled
> holes/vias of up to .020 inches.
> CAF will form there very quickly (hours!) in high >80%
> humidity and mild temperatures (>5 degrees C and < 45
> degrees C).
> This damage area would most likely include edge routing and
> scoring.
>
> You need to do some cross section work ups before you start
> "guessing"!
>
> David A. Douthit
> Manager
> LoCan LLC
>
> Mark Mazzoli wrote:
>
> >
> >
> > For those of you designing or building burn in boards, are
> > any of you building them on Thermount material? One of
> > our customers has shown an interest in this material for
> > their burn in boards and we're trying to decide if that's
> > a wise move or not. Most of their boards use 0.8mm and
> > 0.5mm BGA's and have traditionally been built on
> > Polyimide. The problem is that some percentage of them
> > develop low voltage shorts in the field. Hole to internal
> > traces may be as low as 3 mils when drill wander and
> > material movement are at their worst but normally it's
> > maintained at 6-mils or better. The boards are tested at
> > 40 volts prior to shipping and all pass but some number of
> > them will develop the field problem. CAF is suspected but
> > I'm not so sure. The field failures develop in days or
> > weeks rather than months. I suspect rather than CAF it
> > may be due to the resin system itself. I understand that
> > most Poly manufacturers use a common Poly resin from Ciba
> > and that it has been suspected of developing this low
> > voltage shorting issue (sulfur content I believe).
> >
> > Anyone out there have any comments about the situation
> > itself or comments regarding Thermount (85RT and 55ST)?
> >
> > Thanks,
> >
> > Mark Mazzoli
> > ---------------------------------------------------
> > Technet Mail List provided as a free service by IPC using
> > LISTSERV 1.8e To unsubscribe, send a message to
> > [log in to unmask] with following text in the BODY (NOT the
> > subject field): SIGNOFF Technet To temporarily halt or
> > (re-start) delivery of Technet send e-mail to
> > [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive
> > ONE mailing per day of all the posts: send e-mail to
> > [log in to unmask]: SET Technet Digest Search the archives
> > of previous posts at: http://listserv.ipc.org/archives
> > Please visit IPC web site
> > http://www.ipc.org/html/forum.htm for additional
> > information, or contact Keach Sasamori at [log in to unmask]
> > or 847-509-9700 ext.5315
> > -----------------------------------------------------
>
> --------------------------------------------------- Technet Mail List
> provided as a free service by IPC using LISTSERV 1.8e To unsubscribe,
> send a message to [log in to unmask] with following text in the BODY
> (NOT the subject field): SIGNOFF Technet To temporarily halt or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|