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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
Re: Solder mask m
From:
JOHN OSULLIVAN <[log in to unmask]>
Date:
Fri, 15 Aug 1997 16:47:52 -0400
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, JOHN OSULLIVAN <[log in to unmask]>
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                                                                      15/08/97
                                                                      17:42
 RE>>[TECHNET] Solder mask material

Just to clarify my situation below. Ideally we should use SMOBC on these
boards an did previously however .....
The board is specified to be SMOBC and HASL finish, however the manufacturer
of the PCB has told us that it cannot be reliably produced using this method
as the board is 4mm thick and has a considerable thermal mass, the result is a
very high probability of cracked barrels in the PTH. They have suggested to
try all over tin/lead reflow, but I am having no success as indicated by the
problems described below.

Any further suggestions would be appreciated.

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