What about copper filled vias? I have seen some data on this technology
where they plate the hole completely shut... 

Bill Brooks | Datron World Communications, Inc.
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix
Sent: Tuesday, December 29, 2009 12:29 PM
To: [log in to unmask]
Subject: Re: [TN] Thermally Conductive & Plated Via Fill

Practically speaking, using "thermal conductive" and "CB100" in the 
same sentence is an oxymoron.


Cu ~= 300 w/mK
Solder, Ormet, et al ~= 25 w/mk
CB100 ~=3 w/mK

Small amount more annular copper, filling with Ormet paste (not a 
cheaper option though) or filling via in process with solder yields 
much greater increase in thermal conductivity than CB100.

At 11:55 AM 12/29/2009, Joe Lara wrote:
>Hello TechNetter's,
>
>Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias 
>at $400 per 100G. Is
>there a more affordable way of filling vias that call out to be 
>filled (thermal conductive) and
>plated?
>
>
>Best Regards,
>
>Joe
>
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